佛山Copper plated round wire

The copper-plated round wire grounding electrode is completed by the rack plating process, and the thickness of the copper-plated layer is uniform—the thickness of each point of the copper-plated layer of the grounding electrode is uniform 0.254nm. Copper Plated Steel Round Wire This thickness ensures complete coverage of the bottom of the thread formed by copper plating. The strong adhesion of the copper plating layer - the ground electrode to be tested is fixed between the vise, the distance between the jaws is equal to the electrode diameter minus 1-2 mm. When the pole is squeezed, the vise will cut through the contacting plating, and the rest of the plating on the surface will not fall off, and these platings can ensure that the ground electrode can be threaded after it is grounded. Copper plated. Coating - The plasticity of the bend is up to 30 degrees. No cracks and spalling occurred after the test. The electroformed copper grounding electrode adopts electrolysis technology to form molecular bonds between the steel core and the electroplated copper layer, which effectively solves the problem of easy corrosion of the steel core.

Because copper itself has good electrical conductivity and corrosion resistance, it is very suitable for grounding down lines of various equipment, horizontal grounding conductors of grounding grids, cable trenches and horizontal grounding conductors of towers. But if copper is used, the cost performance will be lower, because copper is more expensive, and sometimes the effect is not so good. Copper-plated round wire is a commonly used horizontal grounding conductor, but its electrical conductivity and corrosion resistance are not very good.